View TXC100_8249950.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

www.rfm.com email: info@rfm.com page 1 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 e lectrical characteristics reference crystal parameters complies with directive 2002/95/ec (rohs) TXC100 product overview TXC100 is a rugged single-chip ask/fsk transmitter ic designed for operation in the 300-450 mhz frequency range. the highly integrated TXC100 includes a complete pll frequency synthesizer plus an rf power amplifier that require very few external components. the TXC100 is very small in size and features high output power and low current consumption making it ideal for a wide range of short-range wireless applications in the industrial, automotive and consumer markets. key features ? operating frequency range: 300-450 mhz ? modulation types: ask/fsk ? operation supply voltage: 2.1 - 3.6v ? high date rate: ook/ask: 100 kbps fsk: 20 kbps ? low current consumption: ook/ask mode: 7 ma typical fsk mode: 10 ma typical ? low stand by current: < 1 na ? adjustable output power: -10 to +10 dbm ? adjustable fsk shift ? programmable clock output ? very low external component count ? extended temperature range: -40 to +125 c. ? small package: 3x3 mm 16-pin tqfn package ? standard 13 inch reel, 2500 pieces typical applications ? active rfid tags ? automated meter reading ? wireless sensor nodes ? home automation ? security systems ? tire pressure monitoring ? remote keyless entry ? automobile immobilizers ? sports & performance monitoring ? wireless toys ? medical equipment ? command & control systems characteristics sym min typical max units operating frequency fo 300 450 mhz modulation types ook/ask/ fsk ask data rate 100 kbps fsk data rate 20 kbps peak rf output power +10 dbm standby current 1 na supply voltage range v dd 2.1 3.6 vdc operating temperature ta -40 +125 o c characteristics sym min typical max units crystal frequency fc fo/32 mhz load capacitance cl 3 pf motional capacitance cm 9 10 ff tolerance tol 30 ppm 3x3 mm package TXC100 300-450 mhz transmitter
www.rfm.com email: info@rfm.com page 2 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 TXC100 block diagram and typical application circuit comp 315 mhz band 433 mhz band c1 100 pf 100 pf c2 100 pf 100 pf c3 3 dnp dnp c4 3 dnp dnp c5 1.0 uf 1.0 uf c6 0.01uf 0.01 uf c7 220 pf 220 pf c8 100 pf 100 pf c9 680 pf 680 pf c10 1 15 pf 3.3 pf c11 1 22 pf 5.6 pf c12 1 15 pf 12 pf c13 1.0 uf 1.0 uf c14 0.01uf 0.01uf c15 220 pf 220 pf c16 1 dnp dnp l1 12 27nh 22 nh l2 12 22 nh 18 nh y1 9.84375 mhz* 13.5600 mhz** 1 matched to 50 ohms 2 use wirewound inductors only 3 use for external reference input dnp - do not populate *hong kong crystal p/n ssl9843750e03fafr800 **hong kong crystal p/n ssm1356000e03fafr800 modulation control mode select (ask / fsk) rf control /n mixer filter osc pa pa output /32 shape 8 7 6 5 14 3 2 11 10 9 15 12 13 d0 d1 d2 mode input tx data input vdd pa clk clk1 clk0 xtal1 ref ext /xtal2 xtal drv logic c 2 c 1 c 4 c 3 c 5 c 6 c 7 c 8 c 9 c 10 c 11 c 12 l 2 l 1 r 1 c 16 pin 4 enable input pin 16 gnd bias 1 c 13 c 14 c 15 v cc component values for typical application circuit y1
www.rfm.com email: info@rfm.com page 3 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 pin description pin configuration pin name description 1 v dd v dd is the supply voltage for the pll and logic circuitry. bypass this pin as close as possible with parallel 1.0 f, 0.01 f, 220 pf capacitors. 2 mode sel the mode select pin allows the TXC100 to be set in either ook/ask or fsk mode: logic low: ook/ask mode logic high: fsk mode in ook/ask mode, data input to the data in pin (3) gates the internal power amplifier. a logic high turns the power amplifier on. a logic low turns off the power amplifier. in fsk mode, data input to the data in pin shifts the carrier frequency by the amount programmed through the dev[2..0] pins (11,12,13). a logic low performs no shift. the frequency of a logic low input in fsk mode is the same frequency as a logic high in ook/ask mode. the fsk deviation is achieved by pulling the crystal frequency. see crystal reference section (pin 15) for more details. the maximum fsk deviation for the 315 mhz band and 433 mhz band is approximately 55 khz and 80 khz, respectively. 3 data in the data input pin turns the power amplifier on/off in ook/ask mode, or high/low frequency in fsk mode: low (ook/ask mode): power amplifier off high (ook/ask mode): power amplifier on low (fsk mode): low frequency high (fsk mode): high frequency 4 stdby the standby input pin selects active or low power shutdown/standby mode: if this pin unconnected or logic low, the TXC100 is placed in low current standby mode. if this pin is logic high, the TXC100 is in active mode and ready to transmit note: lowest current consumption is achieved when all configuration pins are logic low. when this pin sets the device in low power shutdown, the device draws nominally 0.2 na. when the device is brought out of stand by with a logic high input, it is ready for operation within 200 s. this pin has an internal pull-down resistor so it can be pulled lo w or left unconnected.the 200 s turn-on time is due to crystal start-up. an optimally matched crystal will minimize this turn-on time. s ee the crystal reference section (pin 15) for details on crystal load matching. bottom view 3x3mm v dd mode sel data in stdby c l k o u t v d d p a e s o u t p a o u t dev1 dev0 clk1 clk0 d e v 2 x t a l 1 x t a l 2 / r e f i n g n d 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
www.rfm.com email: info@rfm.com page 4 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 5 clk out the clock output is a scaled and buffered version of the crystal frequency, which may be used to drive external logic or a micr oprocessor. the frequency is programmable through pins 9 (clk0) and 10(clk1) as below: fc = crystal frequency 6 v ddpa this pin is a power supply voltage source for the transmitter power amplifier. bypass this pin as close as possible with a 0.01 f and 220 pf capacitor. es out is the alternate power amplifier voltage source as discussed below. 7 es out this pin can be used to supply voltage to the power amplifier instead of v ddpa , allowing the on/off rise and fall times of the power amplifier to be adjusted in ask mode. reducing the rise and fall times reduces the spectral bandwidth of the modulated output signal, and also reduces average transmitter power. rise and fall times are adjusted by placing a resistor in the range of 1k to 5k in series wi th this output, as close as possible to the TXC100 ic to minimize circuit parasitics. the power amplifier side of the resistor should b e bypassed with 680 pf and 220 pf capacitors in parallel, as close to the resistor as possible. 8 pa out power amplifier - the power amplifier is an open-drain, class c amplifier designed for a load impedance at pa out (pin 8) of about 250 ohms. the power amplifier requires a dc path to the supply voltage through a series inductor, which can be part of the output m atching network. a 50 ohm antenna matching network is shown in the typical application circuit section. the matching network also suppresses carrier harmonics to aid in compliance testing. 10, 9 clk[1..0] see description for pin 5 13, 12, 11 freqdev[2..0] the frequency deviation pins set the amount of deviation between data logic states in fsk mode. frequency deviation is programm able through pins 11, 12, 13 as shown in the table below: deviation values are approximate and apply to a properly loaded crystal. crystal characteristics and loading behavior can vary between suppliers. 14 xtal1 external crystal input 1 presents a capacitance of 3 pf to gnd in ask and fsk (data in logic low) modes. circuit parasitics add to this package capacitance, presenting a total load of about 4.5 pf. 15 xtal2/ref in external crystal input 2 presents a capacitance of 3 pf to gnd in ask and fsk(data in logic low) mode. circuit parasitics add to this package capacitance, presenting a total load of about 4.5 pf. the external ref input allows an external frequency source to be used to obtain the desired transmit frequency. in this case, t he xtal1 input must be bypassed with a 0.01f capacitor, and a 0.01f series capacitance should be added into external reference input. crystal reference - the xtal1 and xtal2 inputs are designed to present a 3 pf load to gnd to each reference crystal connection. including pcb parasitic capacitances, this increases to about 4.5 pfat each connection. in ask mode, the full 3 pf load is appl ied to the crystal allowing it to oscillate at the desired frequency. in fsk mode, a portion of the 3 pf load is removed in response to a logic high being applied to the data in (pin 2) as set by the frequency deviation pins dev[0..2] (11,12,13). to achieve larger frequency deviations, use a crystal with large motional capacitance or reduce pcb parasitic capacitance to the extent possible. 16 gnd connect to system ground. note: the ground pad in the middle of the package is the power amplifier ground. it must be connected to system ground thru a l ow inductance path. clk0 clk1 clk out 0 0 0 1 0 fc/4 0 1 fc/8 1 1 fc/16 dev ? ? ? ? dev 2 dev 1 dev 0 .125 x max 0 0 0 .250 x max 0 0 1 .375 x max 0 1 0 .500 x max 0 1 1 .625 x max 1 0 0 .750 x max 1 0 1 .875 x max 1 1 0 max 1 1 1
www.rfm.com email: info@rfm.com page 5 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 absolute maximum ratings dc electrical characteristic (typical values taken at v dd = +3.0 v, t a = +25 c, unless otherwise noted) parameter symbol limit values unit min max operating temperature range t o -40 +125 c junction temperature range t j -40 +150 c storage temperature ragne t s -60 +150 c supply voltage - vdd to gnd v s -0.3 +4 v all pins to gnd -0.3 vdd + 0.3 v note: maximum ratings must not be exceeded under any circumstances and can cause permanent damage to the ic limit values characteristic sym notes min typ max unit test conditions supply voltage v dd 2.1 3.6 v current consumption 0.2 1 t a = +25 c 120 300 t a = +85 c standby i stdby 700 1600 na t a = +125 c 2.9 4.3 pa off, data=0v (ask) 7 10.7 50% duty cycle (ask) 10.5 17.1 ma data = v dd (fsk and ask) 315 mhz band 3.3 4.8 pa off, data=0v (ask) 7.3 11.4 50% duty cycle (ask) supply i dd 1,4 10 18.1 data = v dd (fsk and ask) 433 mhz band digital inputs data input low v il 0.25 v data input high v ih v dd -0.25 v max input current i i 15.5 20 a digital outputs output voltage low v ol 0.25 v clkout, load = 10 pf output voltage high v oh v dd -0.25 v clkout, load = 10 pf
www.rfm.com email: info@rfm.com page 6 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 ac electrical characteristic (typical values taken at v dd = +3.0 v, t a = +25 c, unless otherwise noted) notes: 1. 10 khz, 50% duty cycle 2. dependent on pcb parasitic trace capacitance and crystal parameters. 3. dependent on crystal parameters. 4. transmit efficiency, rf output power, and supply current are heavily dependent on proper output matching and pcb layout. 5. no envelope shaping. limit values parameter sym notes min typ max unit test conditions pll performance vco gain k vco 280 mhz/v -75 315 mhz band -74 433 mhz band freq offset = 100 khz -98 315 mhz band phase noise -98 dbc/hz 433 mhz band freq offset = 1 mhz loop bw bw 300 khz reference spur -40 dbc -56 315 mhz band 2nd harmonic -52 dbc 433 mhz band -56 315 mhz band 3rd harmonic -50 dbc 433 mhz band crystal frequency range f ref f rf /32 mhz fundamental mode, at tolerance 3 50 ppm internal load capacitance 2 3 pf clock output frequency clk out f xtal /n mhz determined by clk1 and clk2 system characteristics frequency range 300 450 mhz 12.2 16.1 ta = -40 c, v dd = +3.6 v 6.1 10 12.4 ta = +25 c, vdd = +3.0 v output power 4 2.7 5.3 dbm ta = +125 c, vdd = +2.1 v into 50 ? matched load start-up time t on 5 160 s stdby to tx rise time tr 5 300 ns 20 fsk (50% duty cycle) max data rate 5 100 kbps ask (50% duty cycle) 55 315 mhz band frequency deviation (fsk) 80 khz 433 mhz band dev[2..0]=111 35 315 mhz band 31 433 mhz band cw 27 315 mhz band transmit efficiency = p out /(v dd *i dd ) 4 25 % 433 mhz band 50% duty cycle power on/off ratio -77 db ask mode frequency stability vs. v dd ? df vdd 4 khz frequency stability vs. temp ? df ta tbd khz -40 c to +85 c
www.rfm.com email: info@rfm.com page 7 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 supply voltage vs supply current 7 8 9 10 11 12 13 14 15 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4 supply voltage, v supply current, ma ma @ 315mhz typical operating characteristics supply voltage vs supply current 7 8 9 10 11 12 13 14 15 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4 supply voltage, v supply current, ma ma @ 433.92mhz supply voltage vs output power 5 6 7 8 9 10 11 12 13 14 2 2.2 2.4 2.6 2.8 3 3.2 3.4 3.6 3.8 4 supply voltage, v output power (po), dbm dbm @ 315mhz supply voltage vs output power 5 6 7 8 9 10 11 12 13 2 2.12.22.32.42.52.62.72.82.9 3 3.13.23.33.43.53.63.73.83.9 4 supply voltage, v output power, dbm dbm @ 433.92mhz output power vs supply current 7 8 9 10 11 12 13 14 15 6 7 8 9 10 11 12 13 output power (po), dbm supply current, ma ma @ 315mhz output power vs supply current 7 8 9 10 11 12 13 14 15 5 6 7 8 9 10111213 output power, dbm supply current, ma ma @ 433.92mhz
www.rfm.com email: info@rfm.com page 8 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 supply current and output power vs esout resistor 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 0.1 1 10 100 1000 10000 resistor, ohms supply current, ma -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 output power, dbm power current f = 315mhz supply current and output power vs esout resistor 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 0.1 1 10 100 1000 10000 resistor, ohms supply current, ma -16 -14 -12 -10 -8 -6 -4 -2 0 2 4 6 8 10 12 output power, dbm power (dbm) current (ma) f = 433.92mhz voltage vs modulation current 5 6 7 8 9 10 11 12 13 14 15 2 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4 voltage, v current, ma 315mhz,fsk,50% dc 315mhz,ask,50% dc supply voltage vs modulation supply current 5 6 7 8 9 10 11 12 13 14 15 2 2.12.22.32.42.52.62.72.82.9 3 3.13.23.33.43.53.63.73.83.9 4 supply voltage, v supply current, ma 433.92mhz,fsk,50% dc 433.92mhz,ask,50% dc
www.rfm.com email: info@rfm.com page 9 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 theory of operation introduction the TXC100 is a crystal-referenced transmitter designed to operate in the 315/433 mhz frequency spectrum. the carrier and crys tal reference relation is given by: f c = f xtal * 32 it is capable of supporting ask and fsk data transmissions at 100 and 20 kbps, respectively. the output power is adjustable fro m -10 dbm to +10 dbm thru a resistor at the es out (pin 7). the fsk frequency deviation is programmable with up to eight different deviation values. the ic also provides a scaled and buffered clock output of the reference crystal for use by an external processor. the clock output frequency scaling programmable. frequency synthesizer the frequency synthesizer is a phase locked loop (pll) circuit with a loop bandwidth of 300 khz. the pll contains a phase dete ctor, charge pump, vco, integrated loop filter, 32 clock divider, and crystal oscillator drive circuit. the internal pll is self contained and requires no external components for filtering or dividing. only a reference crystal is needed. 50 ? ? ? ? output matching when properly matched, the TXC100 can output up to +12 dbm into a 50 ? load. the output is an open-drain configuration which requires a pull-up inductor for biasing. the pull-up inductance serves to provide biasing for the power amplifier and is a high frequency choke to reduce unwanted coupling back into the power supply. maximum power transfer occurs when the output is closely matched to 250 ? . for best performance use wirewound inductors instead of chip inductors. wirewound inductors provide lower insertion loss as opposed to chip inductors. s ee typical application circuit (section iv) for topology and matching component values. pcb layout considerations pcb layout is critical to proper and consistent operation. always use controlled impedance lines from the pa out (pin 8). for a .062 ? thick fr4 board, a 50 ? impedance line is approximately 0.110 ? wide. component spacing is critical as well. keep all output matching components as close together as possible to minimize stray inductance and capacitance that can detune the matching network. keep top side ground planes at l east a board thickness away from the signal output leading to the antenna or rf connector.
www.rfm.com email: info@rfm.com page 10 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 antenna layout considerations most compact wireless designs require a small antenna. loop antennas are often used as they can be designed into small spaces. the design of loop antennas is a fairly lengthy and detailed discussion which is beyond the scope of this datasheet. the object here is to pr ovide a ? rule of thumb ? approach to achieve an appropriate starting point. empirical data will provide the best path to take. the circumference of the antenna should be less than /4 so that the antenna appears inductive. for this, a series matching capacitor is used to tune out the inductance of the antenna, since the antenna appears inductive. the capacitor may be located at the feed point of the antenna or at the ? grounded ? end. the capacitor may be a variable type or several fixed values may be attempted until an optimal match is reached. the us e of a good network analyzer is essential for proper matching and maximum power transfer. for additional information on antenna design see the application notes section of our website: http://www.rfm.com/corp/apnotes.htm . typical test circuit
www.rfm.com email: info@rfm.com page 11 of 11 ?rf monolithics, inc. TXC100 - 08/18/10 package dimensions - 3x3 mm 16-pin tqfn package bottom view 1.50 1.50 0.5 typ. 0.23 typ. 0.5 typ. 0.23 typ. 0.40 0.40 pin 1 indicator top view side view 3.00 3.00 0.75 max 0.25 0.50 0.0~0.05 s e a t i n g p l a n e pin # 1 (all values in mm)

▲Up To Search▲

Price & Availability of TXC100

	To Download TXC100 Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .